At 18.3% CAGR, the Asia Pacific Data Center Cooling Market is Projected to be Worth US$ 10,645.55 Million by 2031, Says Business Market Insights

According to Business Market Insights research, the Asia Pacific data center cooling market was valued at US$ 2,769.64 in 2023 and is expected to reach US$ 10,645.55 million by 2031, registering a CAGR of 18.3% from 2023 to 2031. Advancements in liquid cooling technologies and AI-optimized cooling and quieter cooling solutions are among the critical factors attributed to the Asia Pacific data center cooling market expansion.

Liquid cooling has emerged as an optimal solution to meet the requirements of the high-performance computing (HPC) and data center industries. By negating the necessity for continuous air circulation, liquid cooling markedly diminishes utility consumption, thereby enhancing the energy efficiency of the facility. Liquid cooling technologies have emerged as a popular solution, with ~40% of data centers utilizing it. Companies are forming strategic partnerships to participate in the advancements of liquid cooling technologies. For instance, Mitsubishi Heavy Industries, Ltd. (MHI) and ZutaCore, Inc. formed a strategic partnership in September 2023 to advance sustainable liquid cooling solutions for the data industry to achieve energy efficiency and zero emissions. This collaboration involves MHI's investment in ZutaCore and a white-label sales agreement, combining ZutaCore's HyperCool dielectric direct-liquid-cooling technology with MHI's extensive product line and technological expertise at a global scale. ZutaCore's HyperCool technology is a waterless, direct-on-chip liquid cooling solution that aims to bridge the gap between data industry sustainability and ever-increasing computing power. It delivers 10x more computing, a 50% total cost of ownership (TCO) reduction, and 100% heat reuse, as well as reduces CO2 emissions. This technology is designed to move large amounts of heat off the chip effectively and safely, with no practical limit to heat dissipation. It also aims to reduce the consumption of scarce resources, including energy, water, and land, while reducing capital and operating expenses. This partnership aims to expedite the growth of sustainable liquid cooling solutions crucial for energy efficiency. The comprehensive solution provided by this collaboration offers unprecedented benefits to high-performance computing workloads, server densification, and data center sustainability.

In 2024, STULZ, a global mission-critical air conditioning specialist, unveiled the CyberCool CMU, a cutting-edge coolant management and distribution unit (CDU) designed to optimize heat exchange efficiency in liquid cooling solutions. This innovative unit is set to be launched at Data Centre World Frankfurt 2024, scheduled for May, from 22nd to 23rd, at Messe Frankfurt. The CyberCool CMU is engineered to offer industry-leading levels of energy efficiency, flexibility, and reliability within a small footprint while providing precise control over an entire liquid cooling system. This development aligns with the ongoing efforts to address the escalating heat challenges in data centers and support the evolving demands of various sectors. Thus, advancements in liquid cooling technologies are expected to create lucrative opportunities for the data center cooling market growth in the coming years.

On the contrary, high cost associated with data center cooling hampers the growth of Asia Pacific data center cooling market.

Based on component, the Asia Pacific data center cooling market is segmented into air conditioning system, chillers, air handling units, cooling towers, heat exchangers, humidifiers, and others. The air conditioning system segment held 36.9% share of the Asia Pacific data center cooling market in 2023, amassing US$ 1,020.63 million. It is projected to garner US$ 4,473.10 million by 2031 to expand at 20.3% CAGR during 2023–2031.

Based on cooling type, the Asia Pacific data center cooling market is segmented into room based cooling, row based cooling, and rack based cooling. The room based cooling segment held 58.9% share of the Asia Pacific data center cooling market in 2023, amassing US$ 1,632.40 million. It is projected to garner US$ 6,055.36 million by 2031 to expand at 17.8% CAGR during 2023–2031.

Based on data center type, the Asia Pacific data center cooling market is segmented into hyperscale data center, colocation data center, wholesale data center, and enterprise data center. The hyperscale data center segment held 36.6% share of the Asia Pacific data center cooling market in 2023, amassing US$ 1,013.03 million. It is projected to garner US$ 4,161.74 million by 2031 to expand at 19.3% CAGR during 2023–2031.

Based on industry vertical, the Asia Pacific data center cooling market is segmented into IT and telecom, BFSI, healthcare, manufacturing, government and defense, media and entertainment, retail, energy, and others. The IT and telecom segment held 28.8% share of the Asia Pacific data center cooling market in 2023, amassing US$ 797.95 million. It is projected to garner US$ 3,532.91 million by 2031 to expand at 20.4% CAGR during 2023–2031.

Based on country, the data center cooling market is segmented into China, India, Australia, Japan, South Korea, and the Rest of Asia Pacific. China held 33.3% share of Asia Pacific data center cooling market in 2023, amassing US$ 923.46 million. It is projected to garner US$ 4,005.22 million by 2031 to expand at 20.1% CAGR during 2023–2031.

Key players operating in the data center cooling market are Asetek, Inc; Mitsubishi Corp; Stulz SpA; Vertiv Group Corp.; Aspen Systems, LLC.; Daikin Industries Ltd; Delta Electronics Inc; Danfoss AS; Motivair Corporation; Madison Industries; Fujitsu Ltd; Rittal GmbH & Co KG; Schneider Electric SE; Trane Technologies Plc; Black Box Corporation; Carrier Global Corp; Alfa Laval AB; Hewlett Packard Enterprise Development LP; Boyd Corp; and Evapco Inc, among others.

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