Middle East & Africa Electronic Thermal Management Materials Market
Middle East & Africa Electronic Thermal Management Materials Market is growing at a CAGR of 4.2% to reach US$ 139.22 Million by 2031 from US$ 100.28 Million in 2023 by Product Type, End-use Industry.

Published On: Aug 2025

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Middle East & Africa Electronic Thermal Management Materials Market

At 4.2% CAGR, the Middle East & Africa Electronic Thermal Management Materials Market is Projected to be Worth US$ 139.22 Million by 2031, says Business Market Insights

According to Business Market Insights research, the Middle East & Africa electronic thermal management materials market was valued at US$ 100.28 million in 2023 and is expected to reach US$ 139.22 million by 2031, registering a CAGR of 4.2% from 2023 to 2031. Strong growth of electronics and semiconductor industry and advancements in electronic thermal management materials are among the critical factors attributed to drive the Middle East & Africa electronic thermal management materials market growth.

The rapid expansion of the electronics and semiconductor industry has been a key driver of demand for electronic thermal management materials. As electronic devices become more powerful and compact, they generate higher heat levels, necessitating advanced thermal management solutions to maintain operational efficiency and extend device lifespan. These materials are essential for managing heat in components such as processors, memory modules, and power electronics in devices such as smartphones, laptops, and automotive electronics. In the semiconductor sector, where miniaturization and performance enhancement are crucial, effective heat dissipation has become vital to prevent overheating and ensure stable operation, fueling the demand for innovative thermal management materials. According to Invest India, the global electronics manufacturing services market is anticipated to reach US$ 1,145 billion by 2026, at a CAGR of 5.4% during 2021–2026. In addition, the Internet of Things (IoT) has gained considerable popularity worldwide recently, with businesses acknowledging the significance of connectivity. IoT has enabled every device to be connected to the Internet. According to the International Data Corporation (IDC), 41.6 billion IoT devices will be capable of generating 79.4 zettabytes (ZB) of data in 2025. The increasing penetration of connected devices such as smartphones and other consumer electronics due to the rising popularity of IoT is resulting in an exponential increase in data traffic over the Internet. Electronic thermal management materials, such as thermal interface materials (TIMs), phase change materials, thermal pads, and conductive adhesives, have become indispensable in addressing the heat dissipation needs of modern devices. TIMs, for instance, improve heat transfer from electronic components to heat sinks, allowing devices to operate at optimal temperatures. As processors become more powerful, TIMs with enhanced thermal conductivity are crucial to transfer heat, minimizing temperature buildup efficiently.

The semiconductor industry, a primary driver of electronic device advancements, is also heavily reliant on thermal management materials. With continuous scaling down of transistor sizes, power densities within chips increase, making efficient heat dissipation more challenging. In high-density semiconductor applications such as data centers, the demand for thermal management materials is particularly high, as these facilities run thousands of servers, generating massive amounts of heat. Effective thermal management is crucial to keep these systems running and to reduce energy costs associated with cooling, thus making thermal management materials a vital component in achieving energy efficiency. As per the Semiconductor Industry Association, global semiconductor sales increased from US$ 45.6 billion in November 2022 to US$ 48.0 billion in November 2023. Thus, the rapid growth of the electronics and semiconductor industry is accelerating the demand for electronic thermal management materials. As these industries continue advancing toward more powerful, compact, and energy-intensive applications, innovative thermal management materials are crucial for ensuring performance, safety, and energy efficiency.

On the contrary, high cost and complex manufacturing process hamper the growth of Middle East & Africa electronic thermal management materials market.

By product type, the Middle East & Africa electronic thermal management materials market is segmented into conductive adhesives, thermal management films, gap fillers, thermal gels, phase change materials, thermal greases, and others. The thermal greases segment held 28.0% share of Middle East & Africa electronic thermal management materials market share in 2023, amassing US$ 28.09 million. It is projected to garner US$ 37.30 million by 2031 to register 3.6% CAGR during 2023–2031.

In terms of end-use industry, the Middle East & Africa electronic thermal management materials market is segmented into consumer electronics, automotive, aerospace, telecommunication, and others. The automotive segment held 29.8% share of Middle East & Africa electronic thermal management materials market share in 2023, amassing US$ 29.84 million. It is projected to garner US$ 44.09 million by 2031 to register 5.0% CAGR during 2023–2031.

Based on country, the Middle East & Africa electronic thermal management materials market is categorized into South Africa, Saudi Arabia, the UAE, and the Rest of Middle East & Africa. Our regional analysis states that Saudi Arabia captured 33.2% share of Middle East & Africa electronic thermal management materials market in 2023. It was assessed at US$ 33.33 million in 2023 and is likely to hit US$ 49.32 million by 2031, registering a CAGR of 5.0% during 2023–2031.

Key players operating in the electronic thermal management materials market are 3M Co, DuPont de Nemours Inc, Electrolube Ltd, European Thermodynamics Ltd, Graco Inc, Henkel AG & Co KGaA, Honeywell International Inc, Marian Inc, Master Bond Inc, Momentive Performance Materials Inc, Parker Hannifin Corp, Robnor ResinLab Ltd, Sur-Seal Corp, Tecman Speciality Materials Ltd, and Wacker Chemie AG, among others.

  • In 2024- DuPont introduced the DuPont Pyralux ML Laminate Series, offering high thermal management for extreme environments.
  • In 2023- Henkel introduced Bergquist gap filler TGF 4400LVO for automotive applications, enhancing the efficiency of the control unit and ADAS sensor manufacturing.

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